The Effect of Thermal Cycling Cycles on the Microstructure and Properties of Cu/In-48Sn-xGNSs/Cu Solder Joints
Yongpeng Jin · Journal of Engineering Research and Reports · 2026
This study investigates Cu/In-48Sn/Cu and Cu/In-48Sn-0.05GNSs/Cu solder joints, systematically examining the effects of thermal cycles (200, 400, 600, 800, and 1000 cycles) on the microstructure, shear properties, and shear fracture morphology of the joints. The results indicate...
Open access
Research Article
10.9734/jerr/2026/v28i41858