The paper offers an improvement for leadframe devices to mitigate the occurrence of package chipping rejection during package mechanical singulation. The discussion provides a specialized design of mold chase for mold encapsulation process, and an augmented mechanical cutting tec...
Open access
Research Article10.9734/jerr/2020/v10i217033
Die attach film (DAF) voids detection is one of the challenges during the introduction of non-conductive adhesives for integrated circuit products affecting production control robustness and detection. In this paper, a specialized tool capable to distinguish and quantify the amou...
Open access
Research Article10.9734/jerr/2020/v10i117031
In this study, the flow units of reservoirs of Akos field have been computed with the Stratigraphic Modified Lorenz plot. Cumulative flow capacity and cumulative storage capacity were used for constructing the Stratigraphic Modified Lorenz Plot (SMLP). The flow capacity and stora...
Open access
Research Article10.9734/jerr/2020/v10i117030
The semiconductor industry is becoming more inclined to thinner integrated circuit (IC) packages. Thinner packages with thin wafer or die prefer the die attach film (DAF) technology as the die adhesive material solution. As the wafer goes thinner, it becomes more of a challenge i...
Open access
Research Article10.9734/jerr/2020/v10i117029
The aim of this research is to investigate numerically the behavior of strip footings resting on Sabkha soil reinforced using two methods. Firstly, using a layer of compacted sand reinforced with random distributed fibers beneath footing. Secondly, using a layer of compacted sand...
Open access
Research Article10.9734/jerr/2020/v10i117028
Innovations and breakthroughs either through process, equipment or material is known in semiconductor industries as a positive option in overcoming the existing limitations and assembly handicaps. This presentation discusses the assembly methodology and packaging design of a quad...
Open access
Research Article10.9734/jerr/2019/v9i417026
This study shows that spruce woodmeal can be an alternative cellulosic-based wood additive for newsprint applications. This study used unbleached wood flour produced from Spruce sawdust, ground and sieved to a particle size of 20-40 µm, 40-70 µm, 70-120 µm and 200-...
Open access
Research Article10.9734/jerr/2020/v10i117027
An handsheet study was performed to compare the application of unmodified pearl corn starch and cationic tapioca starch on 100% recycled paperboard. To analyze the benefits tensile index, Canadian Standard Freeness, and starch retention was measured. The results found that cation...
Open access
Research Article10.9734/jerr/2019/v9i417024
Aims: In this research project, a refrigeration system that will preserve the quality of fresh maize was developed. Study Design: Design of refrigeration system. Place and Duration of Study: Department of Industrial and Production Engineering, Federal University of Technology, A...
Open access
Research Article10.9734/jerr/2019/v9i417025
Aims: This research involves the development of a sawdust fired fluidized bed reactor for the production of synthetic gas for domestic cooking. Study Design: A sawdust fired fluidized bed reactor using AutoCAD inventor. Place and Duration of Study: Department of Mechanical Engine...
Open access
Research Article10.9734/jerr/2019/v9i417023