This paper presents the submodeling approach in thermo-mechanical simulation of the die passivation crack encountered in a power leadframe package subjected to temperature cycling condition. Without using modeling and simulation in resolving semiconductor package development iss...
Open access
Research Article10.9734/jerr/2019/v7i216964
The temperature increase causes a heating of the line conductors which is at the origin of the tension drops and the losses joule increases in line which cause a dilation of the line conductors. In this paper, we investigate of the ambient temperature influence on some quantities...
Open access
Research Article10.9734/jerr/2019/v7i116963
Semiconductor packages using solder balls as interconnect to the printed circuit board (PCB) are very popular especially in mobile products like smart phones. Recent requirement to make the package much thinner is very challenging. The solder ball collapse height after the solder...
Open access
Research Article10.9734/jerr/2019/v7i116962
A study of the prevailing management of municipal solid waste (MSW) generated in Ado Ekiti, a city in the southwest of Nigeria was undertaken using desk and field studies. The composition of the MSW derived from on-site waste sampling comprised plastics (28%), food (26%), paper/c...
Open access
Research Article10.9734/jerr/2019/v7i116961
Irrigation is of major importance in many countries. It is important in terms of agricultural production and food supply, the incomes of rural people, public investment for rural development, and often recurrent public expenditures for the agricultural sector. Nigeria’s irrigatio...
Open access
Research Article10.9734/jerr/2019/v7i116960
Using replacement for cement to assure sustainability is critical as the raw materials (limestone, sand, shale, clay and iron ore) used in making cement are depleting. The use of agriculture waste byproducts to replace cement is becoming an economic option. Rice husk ash (RHA), r...
Open access
Research Article10.9734/jerr/2019/v7i116959
Wafer passivation or the protective layer of the internal circuitry of the die plays a major role of providing protection and the isolation of electrical stability of the active circuit on the top area of the wafer. Passivation is normally a screen of an oxide layer on the surfac...
Open access
Research Article10.9734/jerr/2019/v6i416958
In our universe, there is a presence of random bit of disorder in every field that has to be contemplated and understood clearly. This random bit of disorder in a physical system is known as noise. Noise in the field of statistics can be defined as an additional meaningless infor...
Open access
Research Article10.9734/jerr/2019/v6i416957
The design of water resources engineering control structures is best achieved with adequate estimation of rainfall intensity over a particular catchment. To develop the rainfall intensity, duration and frequency (IDF) models, 25 year daily rainfall data were collected from Nigeri...
Open access
Research Article10.9734/jerr/2019/v6i416956
Aims/ Objectives: Multi-regime fundamental models use two or more equations to describe the association among the main maroscopic traffic variables encountered in traffic analysis. The paper investigates specific properties of some multi-phase speed-density equations. Methodolog...
Open access
Research Article10.9734/jerr/2019/v6i416955