Wirebond Process Improvement with Enhanced Stand-off Bias Wire Clamp and Top Plate
Jonathan C. Pulido, Frederick Ray I. Gomez, Edwin M. Graycochea Jr.
Journal of Engineering Research and Reports · pp. 1–4 · Published 13 Jan 2020
10.9734/jerr/2019/v9i317021Abstract
New design for a certain issue in semiconductor industry is another way to modify the standard configuration into specified limit or to make a possible solution of the problem. This paper presents a new modified design for wirebond top plate with a bias platform structure that will maintain a consistent second bond into a leadframe leads with half-etch configuration on quad-flat no-leads (QFN) packages especially in wirebond process. This paper used a side by side comparison to proof that the new design is better than the older design. With the new specialized wire clamp and top plate design, parts per million (PPM) level performances is improved by almost 90%.
Cited by 9
Raymond Albert A. Narvadez, Frederick Ray I. Gomez, Anthony R. Moreno, Edwin M. Graycochea Jr. · Journal of Engineering Research and Reports · 2021
Wenjie Dai, Junfu Liu, Yunpeng Liu · 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) · 2022
Showing 2 of 9 known citations — external sources report more than can currently be individually listed.
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