With the continuous trend of new technologies in semiconductor manufacturing assembly, challenges and issues are unavoidable. This paper presents the modification and improvement done on the process plate design to eliminate the bouncing effect of the silicon die that leads to of...
Open access
Research Article10.9734/jerr/2021/v20i717340
Tape saw singulation is the process where a strip was mounted on the tape attached on the frame and then sawn into single units. Circular tape saw singulation only caters one panel of the two-paneled strip which was found to be consuming with the machine capacity and resources. D...
Open access
Research Article10.9734/jerr/2021/v20i717341
Shopfloor practices that when the first cut line was aligned with the hairline, actual blade cut, and saw street of the strip, the succeeding cut lines will automatically follow with the same alignment. Considering various factors that affect the condition of the strip, it was re...
Open access
Research Article10.9734/jerr/2021/v20i717337
The flooding of River Rima is an annual issue affecting farmland located within the floodplains. This phenomena causes loss of farm produce and mass destruction of buildings, including roads and bridges in the area. Estimating the farmland affected by the flood will help the poli...
Open access
Research Article10.9734/jerr/2021/v20i717338
Different materials such as glass and composite cladding panels are common in the façade industry due to their architectural appearance. The direct sun rays enter the building and might produce discomfort to the occupants, especially in office and institutional buildings. Nowaday...
Open access
Research Article10.9734/jerr/2021/v20i617335
The study adopted qualitative research design to examine Occupational Health and Safety Management System (OHSMS) implementation and organizational performance of Food/ Beverage and Building/Construction industries in Cross River State, Nigeria. Three companies from each category...
Open access
Research Article10.9734/jerr/2021/v20i717336
Gas compressibility factor, also known as gas deviation factor or Z-factor, is a thermodynamic correction factor which describes the deviation of a real gas from ideal gas behaviour. The, free gas Z-factor in the Material Balance Equation (MBE) of single-porosity gas reservoirs w...
Open access
Research Article10.9734/jerr/2021/v20i617331
The rise of various Wafer technologies has been developed based on industries and applications requirement. Highest quality of material characterization is complex and requires specialized process equipment and manufacturing procedures to meet defined design standards. The paper...
Open access
Research Article10.9734/jerr/2021/v20i617332
Electrical power load forecasting, which forms a key element in the power industry's electricity preparation, is used for providing required data for day-to-day system management activities and power utility unit participation. Since the statistical method is a linear model, and...
Open access
Research Article10.9734/jerr/2021/v20i617330
Epoxy quality contributes a great role in defining quality products of quad flat no lead multi row packages. In dealing with certain problems related to epoxy position shift caused by unoptimized design, innovation on the dispenser module is considered and focused at. This paper...
Open access
Research Article10.9734/jerr/2021/v20i617333
The quest for green and sustainable biofuel to serve as alternative to the conventional fossil fuel have remained a grey area in biotechnology. The Chlorella vulgaris was isolated from the African Regional Aquacultural Centre Aluu, Port Harcourt, Nigeria. Sugarcane Molasses modif...
Open access
Research Article10.9734/jerr/2021/v20i617334
A semiconductor package has a silicon die on which an integrated circuit (IC) is fabricated. The die is singulated from a single wafer using processes like mechanical sawing or laser grooving. These processes have impact on the final condition of the silicon die after wafer singu...
Open access
Research Article10.9734/jerr/2021/v20i617328
In welding, the quality of welded joints is greatly influenced by the welding process parameters. Thus, in order to achieve a good weld quality, there is exigency to select the right welding process parameters. The focus of this study is to investigate the effect of Metal Inert G...
Open access
Research Article10.9734/jerr/2021/v20i617327
The paper presents a modified design for wafer level semiconductor devices, using a CAD (computer-aided design) tool for visualization. The discussion provides a specialized manufacturing flow for the augmented die design through advanced wafer fabrication method and wafer cuttin...
Open access
Research Article10.9734/jerr/2021/v20i617329
Glass die are one of the materials used by semiconductor plants during production of specialized quad-flat no-leads (QFN) products. With its transparent appearance and fragile characteristics, several challenges are encountered and analyzed to resolve unwanted issues and to have...
Open access
Research Article10.9734/jerr/2021/v20i617326