The paper is focused on the glue voids reduction on critical semiconductor quad-flat no-leads (QFN) device processed on a stencil printing type of die attach machine. Process optimization through material preparation improvement was done to mitigate the silver lumps of the sinter...
Open access
Research Article10.9734/jerr/2021/v20i317275
The study was conducted to determine the mathematical skills and the academic performance of the junior and senior electrical engineering students of the University of Eastern Philippines. Descriptive-correlational method of research was used with a total enumeration of the regul...
Open access
Research Article10.9734/jerr/2021/v20i317276
With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address th...
Open access
Research Article10.9734/jerr/2021/v20i317277
Technological change has brought the global market into broad industrialization and modernization. One major application in the semiconductor industry demands safety and high reliability with strict compliance requirement. This technical paper focuses on the package design soluti...
Open access
Research Article10.9734/jerr/2021/v20i317273
This paper presents the simulation approach used to understand package crack signatures of a leadframe package under different mechanical loading scenarios. Package crack is one of the common problems with semiconductor packages. A better understanding of the different crack sign...
Open access
Research Article10.9734/jerr/2021/v20i317274
Interface adhesion tests are conducted to obtain a quantitative value of the adhesion strength or interface fracture toughness to forecast initiation and propagation of interface delamination failures in semiconductor packages. One of the common methods of fracture mechanics inte...
Open access
Research Article10.9734/jerr/2021/v20i217282
This paper will discuss the improvement made to increase machine capacity in order to be prepare for incoming demand ramp-up and to free up machine allocation to back-up automotive machine. Using DMAIC methodology (Define, Measure, Analyze, Improve and Control) approach, mold cur...
Open access
Research Article10.9734/jerr/2021/v20i217272
Package delamination is one of the problems in semiconductor packaging. Understanding the delamination mechanism in a specific situation is very important to identify the root cause and implement robust solution. In this study, package deformation modeling was done to analyze the...
Open access
Research Article10.9734/jerr/2021/v20i217278
Pick-and-place (PnP) rubber tip is used for the die attach process in semiconductor packaging. During the die attach process involving a very thin integrated circuit (IC) die, voids in the die attach film (DAF) adhesive were observed. This paper presents the modeling study conduc...
Open access
Research Article10.9734/jerr/2021/v20i217269
In semiconductor packaging industry, silhouetted die defect is occasionally encountered in singulation process esp. on substrate land grid array (LGA) package with tight clearances. This paper is focused on the prevention of the silhouetted die occurrence as it would affect the a...
Open access
Research Article10.9734/jerr/2021/v20i217270
Very thin semiconductor package is very prone to package crack. This paper discusses the stress modeling study conducted to understand the package crack problem in a specific smart card package. Finite element analysis (FEA) was used to analyze the maximum package stress level an...
Open access
Research Article10.9734/jerr/2021/v20i217271
This paper discusses the characterization of an integrated circuit (IC) silicon die fracture strength to have a realistic die crack assessment. The evaluation was conducted using a 3-point bend test setup to measure the die strength of actual IC dies. Both the active side and the...
Open access
Research Article10.9734/jerr/2021/v20i217267
This paper discusses about direct material wastage brought by expiring molding compound particularly for QFN-mr Packages. An Engineering problem solving methodology was used to identify the material, its consumption, cost, the root cause, and solution of the problem. The study ai...
Open access
Research Article10.9734/jerr/2021/v20i217266
Hydrological response of a catchment is a function of rainfall as influenced by catchment characteristics comprising geomorphology, land cover, and management practices. In this study, the analysis mainly focused on how geomorphological characteristics influence the catchment hyd...
Open access
Research Article10.9734/jerr/2021/v20i217268
Aeronautical navigation systems installed at specific locations within Saudi Arabia report the actual observed data of the times to failure (TTFs) for many types of engineering elements made by some typical international highly-acclaimed manufacturers. There is a need to compare...
Open access
Research Article10.9734/jerr/2021/v20i217265