Enhanced Die Attach Process Defect Recognition on QFN Leadframe Packages
Marque Ryan Salcedo, Alyssa Grace Gablan, Jerome Dinglasan, Frederick Ray Gomez
Journal of Engineering Research and Reports · pp. 92–96 · Published 13 Mar 2021
10.9734/jerr/2021/v20i317286Abstract
Advanced packaging at the back-end semiconductor manufacturing characterizes various equipment capabilities per device requirement. High resolution imaging for inspection system during die attach process has gained its interest to feature automated selections during in-line processing. Increasing yet stringent requisites of today’s applications give us leading indicators of market’s demand at more functionality in a smaller and complex package. In light with the technology trend, vision inspection system is a well-known challenge. Instead of using a high magnification microscope off-line after assembly processing, leadframe inspection feature uses optical image-based system to recognize real-time feedback on lead-related defects. Such leadframe inspection activation provides good accuracy, monitoring process integrity in real-time for quad-flat no-leads (QFN) leadframe packages. This paper presents how leadframe inspection at die attach machine takes advantage of simultaneous detection of early die attach defect manifestations.
Cited by 16
Mariane A. Mendoza, Maria Virginia S. Buera, Frederick Ray I. Gomez, Allen Jay D. Kumawit · Journal of Engineering Research and Reports · 2021
Chien-Yi Huang, Chao-Chieh Chan, Chih-Yang Weng · Microelectronics Reliability · 2025
Chien-Yi Huang, Hao-Chun Hsieh, Yan-Cheng Li · Microelectronics International · 2025
Zhiwei Li, Tingrui Sun, Zhendong Du · 2024 4th International Conference on Machine Learning and Intelligent Systems Engineering (MLISE) · 2024
Tingrui Sun, Zhiwei Li, Xinjie Xiao · Journal of Manufacturing Systems · 2025
Tingrui Sun, Zhiwei Li, Xinjie Xiao · Journal of Manufacturing Systems · 2024
Showing 6 of 16 known citations — external sources report more than can currently be individually listed.
Related research
- A Hybrid Cascade Approach for Human Skin Segmentation — shares topic coverage
- A Distance Measure Based on Fuzzy D-implications: Application in Pattern Recognition — shares topic coverage
- Package and Process Design Augmentation of QFN Leadframe Device — shares topic coverage
- Incorporating Package Grinding Process for QFN Thin Device Manufacturing — shares topic coverage
- Modified Sidewall Design of QFN Package — shares topic coverage
Article metrics
Real usage data collected on this platform.
26
Page views
0
PDF downloads
7
Outbound clicks
16
Citations
Views over time
Views by country
Approximate, from request IP at view time — not citizenship or institution. Countries with fewer than 5 views are grouped as "Other".
Traffic sources
Referring site, by host.
Views and downloads exclude known bots/crawlers. Citations combines this platform's own DOI-resolved index with each external source's own reported total — see Cited by above for individually listed citing works. Last refreshed 0 seconds ago.